Packaging Technologies

Research keywords: · soldering · alloy · VPS · SMT · reflow · tin whisker · IMC

Horizon Europe keywords: · Advanced materials · Semiconductors

Faculty of Electrical Engineering and Informatics Department of Electronics Technology

Introduction of the Research Group

The main activities of the research group are the development of new types of composite and micro-alloyed solder materials, the optimisation of their soldering parameters and the investigation of their reliability (such as electrochemical migration, tin pest and whisker phenomena). Furthermore, research on degradable circuit substrates for wearable and degradable electronics.

Achievements Publications Journals Infrastructure Projects Industry relations Conferences Other

Achievements

-Investigating the physical mechanisms of VPS ovens by measurement and numerical simulation of the vapour space and temperature distribution. Investigating the tin whisker phenomena in different material systems and under different environmental conditions.

Publications

N/A

Journals

MEASUREMENT
VACUUM
APPLIED THERMAL ENGINEERING
JOURNAL OF ALLOYS AND COMPOUNDS
MATERIALS
JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
SOLDERING & SURFACE MOUNT TECHNOLOGY
CIRCUIT WORLD
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Infrastructure

ASCON vacuum VPS

Projects

N/A

Industry relations

Bosch

Conferences

Participation in Electro Sub exhibition (Ferihegy 1 is the venue, domestic professional exhibition)

Other activities

IMPAS, IEEE, SiNano, researchers' night